The bonded VEM target assemblies shown include a myriad of custom engineered manufacturing steps in pre- and post- bond/adhesion functions.

Finished target assemblies exhibit the special features demanded by the different cathode designs:

• Metallic Bonding (High Purity Indium)
• High Temperature Ag-Based Epoxy Bond
• Sputter Etch (for removal of Native Oxides)
• Two Thin Film Coating Tools
• Proprietary Blend of Thin Film Coating for Target Adhesion
• Inlay Tile Designs
  (Engineered for co-deposited thin film systems and applications)
• Target Segmenting
  45° Bevel & 90° Butt Joints
• SCAN and X-Ray Bond Inspections

Durable target bonding requires a variety of pre and post bond functions to assure adhesion. Target resurfacing, radius edging and cantilever edging are a few arc-suppression treatments that are separate and distinct for each OEM cathode design.

VEM metallic bond metals and metal alloys are a flexural interface. During high power density PVD plasma bombardment, ductility allows x, y and z expansion and contraction of the target from its backing plate. Thorough bond interfacing enhances high heat thermal transfer to the nearest H2O cooled media.

Target segmenting (bevel or butt fabrications) provide the “stress plane” for large surface area bonded assemblies.